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quad flat pack中文是什么意思
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- 中文翻譯
- 造句
- 方扁形封裝體
- 四邊扁平封裝器件
- 四方扁平封裝
- 四列扁平封裝
- quad n. 1.四方院子；〔俚語〕監獄。 2.＝【印刷】 qu ...
- flat adj. (flatter; flattest) 1.平 ...
- pack pack2 n. 1.包，捆；行李；馱子。 ...
- pack ceramic quad flat 陶瓷四方扁平封裝
- pack quad flat 四方扁平封裝
- pack thin quad flat 纖薄四方扁平封裝
- pack, quad flat (qfp) 四方扁平
- plastic quad flat pack 塑封四邊扁平封裝器件; 塑封四列扁平封裝; 塑料四方扁平封裝
- qf quad flat pack 方形扁平封裝
- qf(quad flat pack ) 扁方型封裝體
- quad flat pack (qfp) 方扁形封裝體
- thin quad flat pack 薄型四方扁平封裝
- ceramic quad flat pack (cqfp) 陶瓷四方扁平封裝
- pack, ceramic quad flat (cqfp) 陶瓷四方扁平
- pack, plastic quad flat (pqfp) 塑料四方扁平
- pack, thin quad flat (tqfp) 纖薄四方扁平
- plastic quad flat pack (pqfp) 塑料四方扁平
- pack, self-solder quad flat (ssqfp) 自焊接式四方扁平
- self-solder quad flat pack (ssqfp) 自焊接式四方扁平
- tqfp (thin plastic quad flat pack 薄型方面平面封裝
- quad palt pack (qfp) 四邊扁平林整器件
- flat pack 扁平包裝; 扁平封裝; 扁平外殼
- flat-pack 扁平封裝; 扁平外殼
- pack, flat 扁平
- ceramic quad flat package 陶瓷四邊引線扁平封裝
- Tqfp thin plastic quad flat pack
薄型方面平面封裝 - Quad flat pack qfp
方扁形封裝體 - Adaptor - carrier quad flat pack to pin grid array sockets for use in electronic equipment , detail specification for
電子設備用插針格柵陣列插座的載體方形扁平組件的適配器用詳細規范 - Adapter - carrier quad flat pack to pin grid array sockets for use in electronic equipment , blank detail specification for
電子設備用插針格柵陣列插座的載體方形扁平組件的適配器用空白詳細規范 - Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - measuring methods for package dimensions of quad flat packs
半導體裝置的機械標準化.表面固定半導體裝置包裝外廓線繪制一般規則.包裝尺寸測量方法 - Mechanical standardization of semiconductor devices - part 6 - 3 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; measuring methods for package dimensions of quad flat packs
半導體器件的機械標準化.第6 - 3部分:表面安裝半導體器件封裝外形圖繪制的一般規則.四面扁平部件封裝尺寸的測量方法 - Mechnical standardization of semiconductor devices - part 6 - 3 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - measuring methods for package dimensions of quad flat packs
半導體器件的機械標準化.第6 - 3部分:半導體器件包裝用表面安裝略圖制備的一般規則.四方塊包裝件包裝尺寸的測量方法 - The transistor count is 3 . 8 million ; the package is surface mount 240 - pin quad flat pack ( qfp240 ) ; and the die size is 98mm2 ; the most advanced research progress on microprocessor architecture is extensively studied to get technical preparations for microprocessor design
該處理器目前正在進行后端設計，即將采用0 . 25 mcmos工藝流片，整個處理器的晶體管數目為380萬，封裝形式是qfp240 ， die面積為98mm ~ 2 。
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